In the patent titled “Low internal temperature technique for hermetic sealing of microelectronic enclosures,” introducing a pioneering method for enclosing microelectronic circuit elements in hermetically sealed packages, setting a new standard in enclosure integrity.

This technique involves the use of a planar ceramic substrate and a box-like ceramic cover sealed with a fused glass coating. Initially applied as a paste, the glass sealant undergoes firing at high temperatures and subsequent cooling to produce a smooth glass coating.

Once the cover is in place on the substrate, the glass coating is remelted by heat generated by four line-focused radiant heaters positioned at the package’s four sides. Each heater’s radiation is precisely focused at the interface line between the cover and the substrate. This focused heat minimizes unwanted heat transfer into the package, preventing damage to heat-sensitive elements.

Upon removal of the radiant heat, the glass hardens through fusion and/or chemical bonding with the cover and substrate, ensuring true hermetic sealing.

Low internal temperature technique represents a significant advancement in encapsulation technology, providing enhanced protection for microelectronic circuit elements while maintaining their integrity.

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Hermetic sealing stands as the pinnacle choice for unparalleled protection in critical applications. Whether it’s safeguarding against the intrusion of air, gases, moisture, or contaminants, hermetic seals are recognized as the benchmark in numerous sectors. However, the efficacy of a seal hinges on selecting the appropriate type for your specific needs. Dive into the world of hermetic sealing technologies to identify the ideal solution for your project.

There are primarily three categories of hermetic seals, each serving distinct purposes:

  • Glass-to-Glass Seals
  • Glass-to-Metal Seals
  • Ceramic-to-Metal Seals

Glass-to-Glass Hermetic Seals: The Transparent Guardian

For applications demanding a flawlessly sealed environment between two glass surfaces, glass-to-glass seals are the go-to option. This method may involve up to five layers in the sealing process, making it perfect for applications such as sealing flat windows, glass tube components, and glass envelopes, among others.

Glass-to-Metal Seals: The Versatile Bond

The fusion of glass and metal to create leak-proof joints characterizes glass-to-metal seals. Their presence is ubiquitous, thanks to their versatility and robustness. Esteemed for their superior hermetic qualities, these seals are indispensable in the manufacture of vacuum tubes, pressure-resistant glass windows, and various electronic components. In the realm of lighting, their most frequent application is in sealing lamp bulbs, showcasing their critical role in everyday technology.

Ceramic-to-Metal Seals: The Fortified Connection

Crafting a ceramic-to-metal seal is a more intricate and costly endeavor compared to its glass-to-metal counterpart. Yet, its value is undeniable for scenarios demanding operation at high temperatures, under high voltage, or in severe conditions. Ceramic’s adaptability to custom designs and its resilience against mechanical and thermal shocks make it a formidable choice for demanding applications.

Hermetic sealing is the definitive solution when absolute impermeability is a must. By exploring the various sealing options available, you can make an informed decision to select the most fitting sealing technique for your needs. For further insights into hermetic seal technologies, visit

As reported by AZoM in their article “New Material to Enable Flexible Batteries,” the challenge of protecting flexible electronics from intrusive gases or liquids has prompted an international team of researchers, including those from North Carolina State University (NCSU), to develop an innovative solution. Published in the February issue of the journal Science, their method involves the creation of a material capable of forming a hermetic seal to safeguard vital components, particularly flexible batteries.

Traditionally, materials used for protection in electronics are rigid, posing a challenge for flexible devices. However, the researchers at NCSU devised a solution using a stretchable elastic material, a eutectic alloy known as gallium and indium (EGaln). This alloy, in a liquid state at room temperature, was encased within an elastic polymer, creating a non-permeable, stretchy material.

To prevent pooling of the EGaln, microscale glass beads were incorporated into the polymer, ensuring an effective barrier against liquids and gases. This innovation essentially forms an elasticated alloy within a flexible sheath, offering robust protection against penetration.

To evaluate its effectiveness, the researchers conducted tests on liquid evaporation and oxygen retention within containers made of the new material, demonstrating its potential for various applications in flexible electronics.

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As detailed in AZoM’s article “Lithium Niobate on Insulator (LNOI) – A Promising Material for Photonic Integrated Circuits (PICs),” the emergence of lithium niobate on insulator (LNOI) has sparked considerable interest in the realm of photonic integrated circuits (PICs). Offering a suite of unique optical properties, including high electro-optic coefficients, intrinsic optical nonlinearities, and broad transparency windows, LNOI presents a compelling platform for diverse photonic applications.

One notable project aimed at harnessing the potential of LNOI technology is led by CSEM, focusing on the development of a Carrier-Envelope Offset Frequency (fCEO) detection unit. This endeavor leverages CSEM’s extensive expertise across the PIC value chain, encompassing design, fabrication, packaging, testing, and system integration.

The fCEO detection unit, based on LNOI waveguide technology, promises significant advantages over conventional approaches, including lower energy requirements and reduced size and cost. By employing a low-loss etching technique, CSEM aims to achieve efficient light coupling and minimal loss levels in LNOI waveguides, critical for optimal device performance.

Furthermore, integrating hermetic sealing within the unit’s design ensures robust protection and longevity, essential for applications in demanding industrial and space environments. This commitment to hermeticity underscores the pivotal role of sealing technology in advancing the reliability and functionality of LNOI-based PICs.

As depicted in the CAD design, the comprehensive packaging solution incorporates components within a standard butterfly 14-pin package designed for seamless integration and thermal management. With a focus on precision and reliability, hermetic sealing contributes to the realization of fully packaged and competitive PIC-based solutions, propelling the adoption of LNOI technology across diverse industrial sectors.

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In a groundbreaking development highlighted in the article “High-Power Microbattery Design Provides Both Higher Voltage and Power” on AZoM, researchers at the University of Illinois Urbana-Champaign have unveiled a high-voltage microbattery with unprecedented energy and power density. Always at the forefront of advancements, the exploration delves into the intricacies of this cutting-edge microbattery design poised to transform the capabilities of microdevices, microrobots, and implanted medical devices.

The study, authored by Material Science and Engineering Professor Paul Braun, Dr. Sungbong Kim, and Arghya Patra, showcases hermetically sealed lithium batteries designed for longevity and compactness. Presented in single-, double-, and triple-stacked configurations, these batteries exhibit remarkable operating voltages, power densities, and energy densities.

Actively exploring the potential applications and integration possibilities of this high-power microbattery design, the focus remains on the future of microscale power. Stay tuned to witness the advancements in microbattery technology.

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In the insightful article “Can Coherent Optics Reduce Data-Center Power?” on Semiconductor Engineering, the quest for efficiency in data centers takes center stage. At the forefront of technological advancements, the exploration of coherent optics and its potential to revolutionize power consumption within data centers is delved into.

As optical bandwidth requirements surge, coherent modulation schemes emerge as a solution to maximize data transmission on the same laser light while minimizing power consumption, especially over extended connections. James Pond, principal product manager for photonics at Ansys, highlights the significance of coherent data communications in optimizing data packing within a given power budget.

While coherent optics traditionally find their place in longer-range applications, there is a growing anticipation of their role in reducing power demands for intra–data-center communications. Actively investigating the possibilities and considering strategies such as lowering individual laser power and minimizing the number of lasers used, the challenges posed by support circuitry are acknowledged by the industry.

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In the realm of space technology, the challenges extend far beyond radiation hardening, and at the forefront of innovative solutions is highlighted in the article “Designing And Securing Chips For Outer Space” by SemiEngineering.

Space-grade hardware demands flawless performance for years, enduring extreme temperature variations, potential collisions with space debris, and exposure to particles in the void. Reliability in space introduces unique design considerations, addressing not only physical tampering but also potential disruptions in communication, data theft, and remote malware uploads. Component failures due to particle collisions or aging create new vulnerabilities, emphasizing the need for robust security measures.

Ian Land, senior director of aerospace and defense vertical solutions at Synopsys, emphasizes the challenge of off-gassing in space. To manage this, modern packaging allows controlled off-gassing, exposing the chip to the environment while mitigating its impact on internal components.

Limited volume and the need for maximum radiation tolerance drive custom-designed chips for high-performance space flight computers. Strict manufacturing processes and meticulous modeling are crucial to ensure consistent results, as devices in space are challenging and costly to replace.

Frank Schirrmeister, vice president of solutions and business development at Arteris IP, underscores the importance of designing platforms that adhere to specific safety and security requirements. The predictability and repeatability of processes become paramount, making model-based systems engineering a valuable approach in the complex space environment.

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As highlighted in the insightful article “Managing Thermal-Induced Stress In Chips” by SemiEngineering, the challenges in advanced nodes and packages have intensified due to escalating density, smaller features, and thinner dies. Recognizing the detrimental impact of thermal stress on chip performance and longevity, the industry acknowledges the need to address these challenges.

In the realm of advanced nodes and packages, dissipating heat becomes increasingly difficult, while mechanical stress and the risk of thermal runaway or accelerated aging rise. Heterogeneous designs pose additional challenges, introducing die shift, warpage, and connection failures between dies. To address these issues proactively, it is crucial to move beyond relying solely on the silicon substrate for heat dissipation.

Ingu Yin Chang, senior vice president at ASE Group, emphasizes the significance of co-planarity and warpage in assembling multiple chips on a single organic substrate. Localized thermal management is a priority to tackle hotspots, and collaboration with suppliers and customers is essential for early identification and comprehensive thermal management.

The industry-wide issues extend from densely packed PCBs to the most advanced packages. Copper balance, initially defined at the board level, has become a critical consideration at the individual package level. Chip Greely, vice president of engineering at Promex, underlines the importance of copper balance to prevent board twisting, bowing, or warpage, especially in multi-device setups.

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Advanced glass-to-metal feedthrough system for implantable medical devices (IMDs) in the patent “Glass-to-metal feedthrough seals having improved durability particularly under AC or DC bias.” This innovation presents a single or multi-pin arrangement featuring selected glass-to-metal seals for a feedthrough, equipped with a ceramic disk member connected to the sealing glass surface in potential contact with bodily fluids.

The intricately designed feedthrough, involving judicious selection of component materials such as ferrules, seal insulators, and pins, facilitates compression or matched seals for electrical feedthroughs. These seals aim to provide corrosion resistance and biocompatibility essential in IMDs. The configuration accommodates either a single pin within a single ferrule or at least two pins within a single ferrule. For the multi-pin arrangement, an insulator material, like alumina ceramic, zirconia ceramic, zirconia silicate ceramic, or mullite with higher melting points than the sealing glass, is distributed around the pin within the ferrule. Alternatively, materials such as feldspar porcelain or alumino-silicate glasses, with lower melting points than the sealing glass, are employed.

The invention serves the field of electrical feedthrough devices, specifically single and multiple pin electrical feedthrough assemblies. It facilitates electrical communication between various electrical components, such as medical electrical leads and diverse sensors, contained within the hermetically sealed IMD.

The application of this innovative feedthrough system extends to various implantable pulse generators, including neurostimulation devices, deep brain stimulators, and body implantable pulse generators (IPGs) designed for treating conditions like bradycardia and tachyarrhythmia. These advancements ensure the integrity of glass-to-metal seals, playing a crucial role in ensuring the reliability and hermetic sealing of critical implantable medical devices.

For a comprehensive understanding of this revolutionary glass-to-metal feedthrough technology and its implications for hermetic sealing in IMDs, the full patent documentation is available here.

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In a remarkable development detailed in the article, “A Versatile Hermetically Sealed Microelectronic Implant for Peripheral Nerve Stimulation Applications,” published on the National Center for Biotechnology Information, unveils a groundbreaking neurostimulation platform. This platform introduces a fully implantable multi-channel neural stimulator designed for chronic experimental studies involving peripheral nerves in large animal models. Notably, the implant is hermetically sealed within a ceramic enclosure and encapsulated in medical-grade silicone rubber, ensuring both longevity and safety.

The stimulator’s microelectronics are implemented using advanced 0.6-μm CMOS technology. They incorporate a crosstalk reduction scheme to minimize cross-channel interference, ensuring precision in stimulation. Additionally, high-speed power and data telemetry enable battery-less operation, a significant advancement in the field. A wearable transmitter, equipped with a Bluetooth Low Energy radio link, and a customized graphical user interface, offer real-time and remotely controlled stimulation, adding to the device’s versatility.

This versatile implant comprises three parallel stimulators, each supporting independent stimulation on three channels. Each stimulator further facilitates six stimulating sites and two return sites through multiplexing. As a result, the implant can support stimulation at up to an impressive 36 different electrode pairs, enabling highly programmable and selective neural stimulation.

The article delves into the intricate details of the implant’s design, the method of hermetic packaging, and its exceptional electrical performance. Furthermore, in vitro testing with electrodes in saline solution underscores the device’s efficacy and safety.

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