In the comprehensive chapter titled “Hermetic Packaging for Resonant MEMS” on Wiley Online Library, the realm of resonant micro electro mechanical systems (MEMS) devices. The chapter unveils the precision and expertise that brings to the packaging of resonant MEMS, including gyroscopes and time reference resonators.

Resonant MEMS devices thrive on the delicate interplay between the natural frequency of hermetically sealed resonators and various signals of interest, such as temperature, stress, acceleration, or pressure. This chapter serves as a pivotal guide, delving into packaging techniques tailored explicitly for MEMS resonators, where vacuum encapsulation and hermetic sealing reign supreme.

Two overarching categories of MEMS packaging techniques, namely die-level packaging and wafer-level packaging, take center stage. These techniques play a pivotal role in shaping the crucial attributes of the resonator, spanning cost, reliability, and performance. However, one aspect stands out as particularly critical: the precise control of pressure within the package.

The versatility of these packaging techniques extends to products that amalgamate various types of resonant MEMS, each with its unique packaging requisites. This includes applications ranging from chemical sensors to gyroscopes, where innovation in packaging techniques finds profound relevance.

The chapter from Wiley Online Library, reveals the intricate world of resonant MEMS packaging and the essential role the company plays in advancing this technology.

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The enlightening article “Cleaning fiber optic connectors” featured on Aerospace Manufacturing and Design highlights the pivotal significance of meticulous fiber optic connector cleaning, particularly within the demanding realm of military aircraft applications. 

In the rugged context of military aircraft, where punishing temperatures, high moisture, relentless winds, and severe shocks are commonplace, the resilience of fiber optic connectors is imperative. Yet, durability alone is insufficient. The connectors demand a meticulous cleaning regimen before connecting their end-faces to ensure optimal performance.

The challenges posed by end-face contamination are multifaceted and formidable. Contaminants ranging from salt fog residue, hydraulic fluid, jet fuel, and atmospheric dust to penetrating oils and vehicle emissions can compromise signal integrity. Even the removal of protective dust caps, which shield end-faces from the factory, can introduce contamination. These minute pollutants, if allowed to persist between mated termini pairs, inevitably traverse end-face surfaces, disrupting signal paths, altering refractive indices, and culminating in signal degradation. In extreme cases, the consequences can escalate to complete system failure.

A relentless source of end-face contamination stems from aircraft motion during operation. The motion-induced friction generates wear debris, manifesting as dust contaminants. Common connectors like MIL 38999 with MIL 29504 termini, prominent in cable-to-panel input/output (I/O) applications in aerospace, are not immune to this challenge. Spring-loaded termini, designed to withstand high vibration, impact, and shock, inadvertently contribute to dust accumulation by grinding particles into ferrule surfaces.

Electro-static charge compounds the contamination dilemma, particularly on ceramic and composite ferrule materials. These materials, acting as insulators, accumulate static charge, attracting charged dust particles. Connectors like MIL 38999 and MIL 29504 exacerbate the issue by adopting end-face geometries that concentrate electro-static charges and draw contaminants to the physical contact points.

The insights from Aerospace Manufacturing and Design, illuminate the path to pristine connectivity.

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The remarkable strides in hermetic sealing of hybrid microcircuits are spotlighted in the article titled “Hermetic sealing of hybrid microcircuits: initial capability development” on pioneers the mastery of microcircuit sealing, setting new standards of precision and integrity.

The establishment of the capability to hermetically seal hybrid microcircuits represents a significant achievement. Rigorous tests underscore the success of this endeavor, revealing helium fine leak rates in the impressively low 10^-8 STP cm^3/s range and moisture content below 500 ppm. This accomplishment is attributed to the meticulous deployment of the 80% gold–20% tin solder sealing process.

Initial production results stand as a testament to commitment, boasting a yield exceeding 90% for the process. This remarkable yield rate highlights the effectiveness and reliability of the chosen sealing approach.

The ongoing efforts are directed toward refining the ability to reseal packages that have been opened for rework, enhancing the overall versatility of their solutions.

The path forward is illuminated by future endeavors that include the evaluation of moisture sensors for application in hybrid packages. Furthermore, the exploration extends to particle impact noise detection testing of sealed packages, ensuring comprehensive quality assurance.

Innovation remains a constant companion, exploring the potential of laser welding as an alternative method for sealing packages. This forward-thinking approach reflects the company’s dedication to uncovering novel solutions that redefine microcircuit sealing.

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