As reported by AZoM in their article “Using Glass to Seal MEMS Devices,” micro-electromechanical systems (MEMS) have revolutionized various industries by consolidating miniaturized mechanical and electrical components onto a single substrate. Essential in fields like medicine, automotive, industry, and defense, MEMS devices demand a hermetic environment to safeguard their delicate internal components.

Hermetic sealing, vital for preserving MEMS device integrity, bars the intrusion of moisture, contaminants, and other external elements. This sealing technique is particularly critical in industries where stability and precision are paramount, such as aerospace, medicine, and telecommunications.

Among the various hermetic sealing methods, glass sealing stands out for its versatility and efficiency, especially in MEMS applications. Utilizing the unique properties of glass, this method ensures reliable encapsulation with minimal stress on bonding surfaces. By employing a three-step process involving screen-printing glass paste, thermocompression bonding, and precise temperature and pressure control, glass sealing offers a robust solution adaptable to various microsystem surface materials.

One key aspect of glass sealing lies in tailoring the coefficient of thermal expansion (CTE) of the glass composition to match that of different materials. This customization ensures structural integrity even under temperature fluctuations, crucial for MEMS devices’ reliable performance.

Mo-Sci, a leading glass technology company, specializes in developing customizable sealing glasses tailored to specific CTE requirements. Their expertise in glass sealing solutions makes them an ideal partner for MEMS manufacturers, offering a range of glass–metal and glass–ceramic seals engineered to endure extreme temperatures while maintaining hermetic integrity.

Click here to learn more about Hermetic Seal Technology’s capabilities and products.

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