As explored in Semiconductor Engineering’s article “Challenges Grow for Medical ICs,” the rapid expansion of the medical device industry brings unprecedented challenges in integrated circuit (IC) design, manufacturing, and packaging. These chips—used in pacemakers, neurostimulators, and biosensors—require levels of precision and reliability far beyond those demanded in consumer electronics.
Medical ICs must operate flawlessly within the human body for decades without replacement. Power efficiency is paramount, often requiring ultra-low-voltage operation and design techniques like dynamic voltage scaling (DVS) and adaptive clocking. Unlike consumer chips built at sub-10nm nodes, medical ICs favor mature nodes (22nm to 180nm) due to their proven reliability and lower leakage current.
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Article with all rights reserved, courtesy of Semiconductor Engineering —– https://semiengineering.com