As reported in the ResearchGate publication “Monitoring of Properties of Epoxy Molding Compounds Used in Electronics for Protection and Hermetic Sealing of Microcircuits,” the reliability and service life of microelectronic devices depend heavily on the careful selection and monitoring of epoxy molding compounds. A poor choice in formulation can lead to mechanical failures such as stress cracking, delamination, and eventual microcircuit damage.
Epoxy molding compounds are widely used in the encapsulation and sealing of sensitive microelectronic components, protecting them from environmental exposure, vibration, and thermal cycling. These compounds must be precisely engineered and tested to prevent unwanted stress accumulation, which could distort the microcircuit’s shape or lead to packaging defects.
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