In Power Electronics World’s article, “Effective Hermetic Sealing for Next-Generation Microelectronic Packaging,” the importance of hermetic sealing in semiconductor chip packaging is emphasized. Hermetic, or leak-proof, sealing protects microelectronic components from contaminants like moisture, which can damage sensitive circuits and connections. This sealing process is crucial for chips that start as wafers, go through precision cutting, and are then bonded to ceramic packages using die-attach epoxy or eutectic solders.
The chips are placed into ceramic packages, or “chip carriers,” which are multilayered with embedded electrical feedthroughs. These packages are then mounted onto printed circuit boards alongside other electronic components, with various package styles available, such as leaded chip carriers (LCC), ceramic quad flatpacks (CQFP), and quad-flat packages (QFP).
Effective hermetic sealing becomes vital to protect the fine wire bonds—some thinner than a human hair—connecting the chip to the ceramic package. This process ensures that the chips, which may range from a few millimeters to several centimeters and can have hundreds of delicate wire bonds, remain free from external contaminants and maintain reliable performance throughout their operational lifetime.
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Article with all rights reserved, courtesy of Power Electronics World