As highlighted in the insightful article “Managing Thermal-Induced Stress In Chips” by SemiEngineering, the challenges in advanced nodes and packages have intensified due to escalating density, smaller features, and thinner dies. Recognizing the detrimental impact of thermal stress on chip performance and longevity, the industry acknowledges the need to address these challenges.

In the realm of advanced nodes and packages, dissipating heat becomes increasingly difficult, while mechanical stress and the risk of thermal runaway or accelerated aging rise. Heterogeneous designs pose additional challenges, introducing die shift, warpage, and connection failures between dies. To address these issues proactively, it is crucial to move beyond relying solely on the silicon substrate for heat dissipation.

Ingu Yin Chang, senior vice president at ASE Group, emphasizes the significance of co-planarity and warpage in assembling multiple chips on a single organic substrate. Localized thermal management is a priority to tackle hotspots, and collaboration with suppliers and customers is essential for early identification and comprehensive thermal management.

The industry-wide issues extend from densely packed PCBs to the most advanced packages. Copper balance, initially defined at the board level, has become a critical consideration at the individual package level. Chip Greely, vice president of engineering at Promex, underlines the importance of copper balance to prevent board twisting, bowing, or warpage, especially in multi-device setups.

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