In the paper titled “Hermetic Sealing of Microelectronics Packages Using a Room Temperature Soldering Process,” an innovative approach to hermetically sealing microelectronic packages without subjecting components to high reflow temperatures is unveiled.

The process involves utilizing a multilayered reactive foil comprised of nanoscale layers of elements with large negative heats of mixing, such as aluminum and nickel. Activation of the reaction in the foil through a small electrical or thermal stimulus generates heat, melting the adjoining solder layers and permanently joining the package lid to the base.

This method achieves a hermetic seal between an Au-plated stainless steel lid and base, showcasing helium leak rates of less than 1 x 10-10 atm-cc/sec. Remarkably, this sealing process eliminates the need for high reflow temperatures and expensive methods like laser welding, offering a cost-effective and efficient alternative.

The room temperature soldering process represents a significant advancement in microelectronics packaging, enhancing reliability while reducing manufacturing costs and equipment requirements.

Click here to learn more about Hermetic Seal Technology’s capabilities.

Article with all rights reserved, courtesy of researchgate.net

Photo with all rights reserved, courtesy of depositphotos.com