In the article titled “Hermetic Sealing of Microelectronics Packages Using a Room Temperature Soldering Process,” a method utilizing a multilayered reactive foil is presented to achieve hermetic sealing in microelectronic packages. The foil consists of nanoscale layers of elements with negative heats of mixing, such as Al and Ni. By activating the reaction with a small electrical or thermal stimulus, the heat generated melts the solder layers and permanently joins the package lid to the base. This process eliminates the need for high reflow temperatures, offers low helium leak rates, and serves as a cost-effective alternative to methods like laser welding.
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