In a patent titled “Method for hermetically sealing electronic devices,” a technique for creating hermetic seals in electronic device packages is described. The method involves the use of a stencil member with a closed loop opening, surrounded by web members, to secure the inner portion of the stencil. A glass slurry is forced through the stencil opening onto a substrate, forming a closed loop of glass. This loop is then glazed and bonded to the first substrate, which acts as a cover plate. The glass loop surrounds the electronic device and contacts the second substrate, creating a hermetic seal. Cooling solidifies the glass, ensuring isolation from the external environment.

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